Himanshu Ranjan Verma
Indian Institute of Technology (Banaras Hindu University), India
Title: A low temperature procedure for the delamination of waste printed circuit boards by dissolution of epoxy resin substrate
Biography
Biography: Himanshu Ranjan Verma
Abstract
A new technique of waste printed circuit boards (WPCBs) recycling by dissolution of brominated epoxy resin (BER) in dimethyl formamide (DMF) has been investigated. Dissolution of BER is highly influenced by parameters like temperature, size, WPCB: DMF etc. and it results separation of layers of WPCBs. WPCBs of 1cm2, 2cm2 and 3cm2 were separated into components after 120 min, 180 min and 240 min respectively at 408 K and 300 g/l. DMF after usage was recycled and analyzed by gas chromatography, proton and carbon nuclear magnetic resonance spectroscopy. Residue obtained after recycling of DMF was analyzed by Fourier-transforms infra-red spectroscopy and scanning electron microscope-energy dispersive X-ray. Investigation of mechanism of dissolution revealed that H-bonding plays a very important role. This technique featuring separation of different components, regeneration of DMF, recovery of BER makes the process extremely cost effective, negligible effluent generating and thus, resulting cleaner processing of WPCBs.